• UL listed

• MIL-PRF-55110 certified GF, GI Materials

• 70 % of current production built to IPC-6012 Class 3 or MIL-PRF-55110

• 3 day (prototype) to 3 week (standard production) lead times

• Up to 24 layers (.150 thick)

• ROHS/Lead Free compliant Laminate and Surface finishes (ENIG, Immersion Ag)

• Mixed Material Construction, Via Filling, Blind and Buried vias

We are committed to providing defect-free products by adhering to the highest standards.  To ensure our products satisfy our customers, our quality control systems focus on the most critical variables of each process.  All company personnel receive extensive training from basic techniques to advanced SPC techniques so that each operation is thoroughly examined.  Each circuit board is studied from the inner layers to the surface, making sure each product is defect free before it leaves Pho-Tronics.

Engineering

• Mania Barco Cam Software  “UCAM Version 7”

• DRC checks

• Design for manufacturability review

• Design for testability review

• Impedance modeling and verification

Layer Construction

• Minimum core thickness: .004"

• Minimum dielectric: .003"

• Blind and buried via's

• Sequential lamination

Lamination

• Maximum number of layers: 24

• Maximum board thickness: .150"

• Minimum board thickness: .016"

Drilling

• Minimum finished mechanical hole size: .005"

• Layer-to-layer registration: +/- .004"

PTH Process

• Electroless copper

• Electrodeposited copper

• Maximum high aspect ratio: 10:1

Plating

• Gold edge connectors

• Edge plating

Final Finishes

• Lead free HASL

• Hot air solder level (HASL)

• Immersion gold

• Immersion tin

• Immersion silver

• Nickel, selective or full body

• Gold, selective or full body

Soldermask / Legend

• Per IPC-SM-840

• Liquid photo-imageable (LPI)

• Dry Film

• Soldermask colors: green, red, blue (call for additional colors)

• Legend colors: white, yellow (call for additional colors)

• Via fill (conductive and non-conductive ink)

• Via plug & cap

• Carbon paste

Fabrication

• Tolerance on overall dimensions:

• Minimum inside radius:

• Numerically controlled routing

• Controlled depth score, jump score

• Beveling

• Countersinking, counter-boring

• Edge milling

Electrical Test

• Electrical test parameters compliant with IPC

• Probe testing

• Standard test parameters: isolation - , continuity - , voltage -

Impedance Measurements

• Impedance coupons serialized to individual board

• Single-ended and differential impedances

Laboratory

• Standard and thermal stress cross-section evaluation (IPC-6012)

• Layer construction verification

• SIR testing

• XRF testing

• Failure analysis

Quality Systems / SPC

• IPC-A-600, IPC-6012 trained personnel

• Military certified MIL-P-55110

• UL approved